Our company is expanding its business globally by providing various products in the electronics industry, automobiles, housing, infrastructure, environment and medical related fields, based on its core technologies of adhesive technology and coating technology. One of the main products is adhesive tape. Adhesive products are required to have adhesive reliability, as well as peelability that can be easily peeled off when desired. For example, in a semiconductor manufacturing process, it is required to have both adhesive reliability that protects the surface during wafer processing and peelability that allows the wafer to be peeled off cleanly without any residue. We have launched ELEP HOLDERTM, which is lightly peeled by UV light, and REVALPHATM, which is lightly peeled by heat. They are widely used in electronic product manufacturing processes around the world.
We developed the electric de-bonding system as a new technology.
This technology has advantages:
We are seeking startups that want to design products and develop business using electric de-bonding technology.
In your response, please include:
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