Inactive

Daikin is looking for HVAC services solutions

Deadline: July 14, 2023

Overview

Daikin’s Open Innovation Lab Silicon Valley (‘DSV’), is Daikin’s innovation arm that aims to support Daikin’s business units across the globe in supporting its digital transformation initiative. The process follows an internal innovation pipeline, which starts from product discovery phase through implementation of innovative technologies to develop a true service solution business.

DSV invites startups of all stages and from all over the world to submit ideas and insights to collaborate and help develop solutions for our stakeholders (which include not only indoor occupants and building owners but also various collaborators such as maintenance service providers, facility managers). DSV welcomes creative solution which provide HVAC services and solutions fit the new post pandemic needs for residence home and office.

Focus Areas

-Theme 1: Indoor Air Quality. Through better air quality, how we can create values including infection risk mitigation, work efficiency improvement, better quality of sleep (Ex: sensing, analytics, visualization)

-Theme 2: Decarbonization of buildings/electricity grid. How we can decarbonize buildings which generates about 40% of annual global CO2 emissions. How we can contribute to the stability of electricity grid with more renewables. Eg. electrification for space heating, related data acquisition, visualization, reporting, optimization, Demand Response

-Theme 3: Smart Home/Commercial HVAC solutions. How we can provide value added services and solutions based on diverse customer needs. Eg. occupancy detection, optimal ventilation control, predictive maintenance, energy management.

-Theme 4: Business process innovation which includes but not limited to Metaverse, SalesTech, FinTech, InsureTech, PropTech related to the areas above mentioned

-Other: DSV welcomes creative ideas from startups in other verticals as well with a preference on AI/IoT-related technologies.

Deadline: July 14, 2023

March 17, 2023

Overview

Focus Areas

-Theme 4: Business process innovation which includes but not limited to Metaverse, SalesTech, FinTech, InsureTech, PropTech related to the areas above mentioned

-Other: DSV welcomes creative ideas from startups in other verticals as well with a preference on AI/IoT-related technologies.

Application process

Please apply to this opportunity and send us a deck pitch describing your solution, use studies, and possible collaboration areas by July 14, 2023.
The deck can be sent to the email indicated in this opportunity, under contact MIT Startup Exchange with questions.

Disclaimer: Please make sure to submit non-confidential slides

All responses will be reviewed. Applicants will be notified whether the response has been accepted for further consideration by July 31 , 2023

Application Deadline: July 14, 2023

Application process
Please apply to this opportunity and send us a deck pitch describing your solution, use studies, and possible collaboration areas by July 14, 2023.

The deck can be sent to the email indicated in this opportunity, under contact MIT Startup Exchange with questions.

Disclaimer: Please make sure to submit non-confidential slides

All responses will be reviewed. Applicants will be notified whether the response has been accepted for further consideration by July 31 , 2023

Application Deadline: July 14, 2023

Disclaimer: MIT Startup Exchange can make introductions that ideally provide open ended discussions in order to share mutual interests and potentially create common ground that incite the parties to collaborate. MIT Startup Exchange introductions may eventually lead to mutual partnerships, but that is not in any way guaranteed by MIT, MIT Corporate Relations, MIT Industrial Liaison Program (ILP) or MIT Startup Exchange, which takes no responsibility for these outcomes and no formal part in such discussions following our introduction. MIT Startup Exchange and its activities and events are not for purposes of soliciting investment or offering securities.