The 2024 MIT Japan Conference will feature future trends of research at MIT and highlight advances in key areas, including autonomous vehicle navigation, chemical engineering, the Chinese economy, energy storage and conversion, healthcare technologies, and materials science.
Please visit the MIT ILP site for the full agenda.
MIT Startup Exchange is looking for 10 startups to present and exhibit at the MIT Japan Conference in Tokyo on Tuesday, January 23, 2024.
Meter: Next-generation volumetric imaging for manufacturing inspection Realtime Robotics: Autonomous Motion Planning and Spatial Perception for Industrial Automation Akasha Imaging: "See it, Build it!" Perception Solutions for Manufacturing Eureka Robotics: Enabling High Accuracy – High Agility automation
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Sertac Karaman, Cofounder, Optimus Ride
Leading petrochemical company seeks technologies to enable weight reduction of thermoplastics in packaging and the automotive industry.
Early-stage backers of Rivian, JIMCO seeks MIT spin-off startups that are initiating or improving commercialization efforts across multiple industries - eg. energy, water, mobility.
The Taiwan Chip-based Industrial Innovation Program (Taiwan CbI) is a collaborative effort by various Taiwanese government ministries, leveraging Taiwan’s semiconductor expertise by integrating chips with key innovations. Startups should be focused on IC design innovations and Chip-based innovative applications in the following industries: data & security, mobility, sustainability, manufacturing and medtech.
The 2025 MIT Japan Conference will explore future research trends at MIT, highlighting breakthroughs in key areas such as Soft Materials and Mechanics, Biomedical Innovation, and the impact of Generative AI (GAI) on the Work of the Future. Additional sessions will focus on Quantum and Silicon Photonics, Nanotechnology in materials and additive manufacturing, and the latest Machine Learning and AI tools for chemical discovery. Advances in semiconductor technology, hydrogen innovation, and electrochemistry, as well as thermofluidic interfaces, will also be featured.