The Taiwan Chip-based Industrial Innovation Program (Taiwan CbI) is a collaborative effort by various Taiwanese government ministries, leveraging Taiwan’s semiconductor expertise by integrating chips with key innovations. Startups should be focused on IC design innovations and Chip-based innovative applications in the following industries: data & security, mobility, sustainability, manufacturing and medtech.
MIT Industrial Liaison Program (MIT ILP) and MIT Startup Exchange (MIT STEX) are opening applications for 3 innovative startups to participate in the 2026 MIT Enterprise AI Forum—a high-level forum bringing together MIT faculty, senior industry executives, and enterprise innovators focused on AI that works in the real world.
The overall theme is operations.
Halliburton Labs is looking for their next cohort. Applications now open by July 26.
BMW Manufacturing is co-organizing an Innovation Exchange, an event designed to bring together startups and leading industry corporations. Participating industry partners include BMW Manufacturing, Michelin NA, GE Vernova and Current Lighting. The event will take place on May 13. Applications are due by April 10.
SE Ventures is looking for startups building in Energy Tech, Industrial Tech, and Enterprise AI, especially across. Select startups will collaborate directly with Schneider Electric experts and customers, access a global ecosystem of integrators and more. Deadline to apply: January 30, 2026
Safran Explore is looking for the technologies that will shape the future of aerospace, defense, and space. Five challenges are currently open until September 30. Select startups will access technical, business & industrial support, access test facilities, R&D teams, fast-track industrialization and more.